Role of bimodal distribution in tailoring the inter-particle interactions in Cu79Co21 nanogranular films

Dinesh Kumar, Sujeet Chaudhary, Dinesh K. Pandya

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Nanogranular Cu79Co21 films were deposited by magnetron co-sputtering and their magnetotransport properties were investigated as a function of thickness (t). The fitting of magnetoresistance (MR) data reveals the presence of bimodal distribution of Co-particles. With the increase of film thickness from 25 to 200 nm, whereas smaller particle (2.5 nm) distribution remains unaffected, the bigger one grows monotonically from 3.3 nm to 4.9 nm for 25 ≤ t < 100 nm and stays same (4.9 nm) for 100 ≤ t ≤ 200 nm. From MR data recorded in the range of 20-300 K, it is observed that dependence of MR on thickness keeps on reducing on lowering the temperature. This observance has been presented in terms of presence of bimodal distribution and its role in tailoring the inter-particle magnetic interactions.

Original languageEnglish
Title of host publicationSolid State Physics - Proceedings of the 58th DAE Solid State Physics Symposium 2013
PublisherAmerican Institute of Physics Inc.
Pages1541-1543
Number of pages3
ISBN (Print)9780735412255
DOIs
StatePublished - 1 Jan 2014
Externally publishedYes
Event58th DAE Solid State Physics Symposium 2013 - Patiala, Punjab, India
Duration: 17 Dec 201321 Dec 2013

Publication series

NameAIP Conference Proceedings
Volume1591
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference58th DAE Solid State Physics Symposium 2013
Country/TerritoryIndia
CityPatiala, Punjab
Period17/12/1321/12/13

Keywords

  • Bimodal distribution
  • Magnetoresistance
  • Nanogranular films

ASJC Scopus subject areas

  • General Physics and Astronomy

Fingerprint

Dive into the research topics of 'Role of bimodal distribution in tailoring the inter-particle interactions in Cu79Co21 nanogranular films'. Together they form a unique fingerprint.

Cite this