Keyphrases
Bonding Process
100%
Melting Temperature
100%
Intermetallic Phases
100%
Sealing Technique
100%
Remelting
100%
Wafer Level
100%
Integrating Cavity
100%
Service Life
50%
Silicon Substrate
50%
Low Temperature
50%
Annealing
50%
Thermal Treatment
50%
SEM Analysis
50%
Leakage Rate
50%
Microsystems
50%
Phase Growth
50%
XRD Analysis
50%
Processing Temperature
50%
Multilayer Structure
50%
Debonding
50%
Ti-Ag
50%
Sealed Joint
50%
Helium Leakage
50%
Void-free
50%
Reflow Temperature
50%
Leak Detection
50%
Layer Thickness Ratio
50%
Air Lead
50%
Helium Leak Detection
50%
Engineering
Joints (Structural Components)
100%
Intermetallics
50%
Melting Temperature
50%
Bonding Process
50%
Service Life
25%
Layer Thickness
25%
Heat Treatment
25%
Low-Temperature
25%
Growth Phase
25%
Silicon Substrate
25%
X-Ray Diffraction Analysis
25%
Microsystem
25%
Thickness Ratio
25%
Leak Rate
25%
Debonding
25%
Leak Detection System
25%
Material Science
Intermetallic Compound
100%
Scanning Electron Microscopy
50%
Silicon
50%
X-Ray Diffraction
50%
Debonding
50%
Laminate
50%
Leak Detection
50%