Abstract
A new method for mechanical testing of lead-free solder joints solderability is presented. Copper blanks are soldered with a known thermal cycle. Miniature tensile solder joints specimens are produced in large numbers from the blanks having a gage section made of lead-free solder alloy with dimensions that represent actual solder joints. Mechanical properties of Sn-3.5Ag-0.7Cu in tension at room temperature and strain-rates between 2.8 × 10-4-2.7×10-1s-1 have been studied. It is concluded that the solder section of the miniature joints is the weakest link in this complex structure. It was also found that the experimental results for solder strength and strain-rate sensitivity are in partial agreement with data obtained using solder bulk specimens. The role of microstructure across the joint, especially intermetallic compounds along the copper/solder interface is also discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 417-424 |
| Number of pages | 8 |
| Journal | Journal of Testing and Evaluation |
| Volume | 36 |
| Issue number | 5 |
| State | Published - 1 Sep 2008 |
Keywords
- Intermetallic compounds
- Mechanical properties
- Mechanical testing
- Miniature tensile specimens
- Solder joints
- Solder lead-free alloys
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Mechanical Engineering