Simulation of thin film delamination under thermal loading

L. Chernin, K. Y. Volokh

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

The qualitative study of the influence of different parameters of the thin film and the cohesive layer as well as different thermal load on delamination behavior of the film-substrate systems was carried out using finite element analysis. The reults of the analysis show that the stability of the delamination propagation depends mainly on the shape of the thermal load and less on the distribution of the cohesive surface strength along the film. The location of the nucleation of the film separation was essentially sensitive to the formation of the cohesion properties of the film/substrate interface. It was found that the interior blisters, the arrested delamination processes were carried only for special cases of the film.

Original languageEnglish
Pages (from-to)259-273
Number of pages15
JournalComputers, Materials and Continua
Volume1
Issue number3
StatePublished - 16 Dec 2004
Externally publishedYes

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