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Simulation of thin film delamination under thermal loading
L. Chernin, K. Y. Volokh
Research output
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Contribution to journal
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Article
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peer-review
2
Scopus citations
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Dive into the research topics of 'Simulation of thin film delamination under thermal loading'. Together they form a unique fingerprint.
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Keyphrases
Thermal Load
100%
Thermal Loading
100%
Thin Film Delamination
100%
Blister
50%
Finite Element Analysis
50%
Film Separation
50%
Delamination Behavior
50%
Delamination Propagation
50%
Delamination
50%
Cohesive Layer
50%
Cohesive Properties
50%
Cohesive Surface
50%
Film-substrate System
50%
Film-substrate Interface
50%
Surface Strength
50%
Engineering
Thin Films
100%
Delamination
100%
Thermal Load
66%
Finite Element Method
33%
Delamination Propagation
33%
Cohesive Surface
33%
Substrate Interface
33%
Cohesive Layer
33%
Material Science
Film
100%
Thin Films
100%
Delamination
100%
Thermal Load
40%
Finite Element Method
20%
Nucleation
20%
Mechanical Strength
20%