Stress-enhanced dynamic grain growth during high-pressure spark plasma sintering of alumina

Keyphrases

• High Pressure 100%
• Aluminum Oxide 100%
• Grain Size 100%
• Grain Growth 100%
• Enhanced Dynamics 100%
• High-pressure Spark Plasma Sintering (HP-SPS) 100%
• Dynamic Grain Growth 100%
• Strong Correlation 50%
• Low Temperature 50%
• Ceramic Materials 50%
• Dynamic Stress 50%
• Applied Pressure 50%
• Spark Plasma Sintering 50%
• Microstructural Observation 50%
• Fine-grained Microstructure 50%
• Sintering Process 50%
• Creep Strain 50%
• Sintering Temperature 50%
• Grain Boundary Migration 50%
• Ceramic Sintering 50%
• Superplastic Deformation 50%
• Grain Boundary Sliding 50%
• Grain Rotation 50%
• Grain Coalescence 50%
• Grain Growth Rate 50%
• Submicron Alumina 50%

Engineering

• Aluminum Oxide 100%
• Spark Plasma Sintering 100%
• Microstructure 50%
• Low-Temperature 50%
• Grain Boundary 50%
• Strain Rate 50%
• Sintering 50%
• Common Practice 50%
• Final Stage 50%
• Applied Pressure 50%
• Dynamic Stress 50%
• Sintering Temperature 50%
• Boundary Migration 50%
• Creep Strain 50%
• Grain Boundary Sliding 50%
• Superplastic Deformation 50%
• Sintering Process 50%

Material Science

• Aluminum Oxide 100%
• Sintering 100%
• Spark Plasma Sintering 100%
• Grain Size 100%
• Strain Rate 50%
• Grain Boundary 50%
• Creep 50%
• Sintering Temperature 50%
• Grain Boundary Sliding 50%
• Ceramic Material 50%