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Structural and chemical modifications in Cu-supported C60 thin films exposed to an atmosphere of air or iodine

  • E. A. Katz
  • , D. Faiman
  • , S. Shtutina
  • , N. Froumin
  • , M. Polak
  • , A. P. Isakina
  • , K. A. Yagotintsev
  • , M. A. Strzhemechny
  • , Y. M. Strzhemechny
  • , V. V. Zaitsev
  • , S. A. Schwarz

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

Structural and chemical changes in C60 thin films, grown on a Cu substrate and exposed to air or I2 atmosphere, at room temperature, were monitored by X-ray diffraction, Auger electron and X-ray photoelectron spectroscopy. Exposure to air is demonstrated to result not only in oxygen diffusion but also in a counter diffusion of the metal from the substrate into the C60 matrix. In particular, 10 months of air-exposure led to the presence of Cu and O atoms at all depths over the sample and the formation of a complex which we refer to as CuxOyC60. The new phase is quasi-stable at room temperature, but a relatively short thermal annealing at 150°C destroys it and restores the initial C60 FCC lattice. After 10 min of exposure of the Cu-supported C60 films to an I2 atmosphere the Cu sub-layer disappears completely and macroscopic amounts of a stable CuI phase are formed over the entire thickness of the C60 film. To explain the results a model of chemically-induced counter electro-diffusion is proposed. We propose the possible usefulness of this counter diffusion approach for tailoring C60 -based materials doped with various compounds in the form of both phase-separated composites and solid solutions (intercalated fullerides).

Original languageEnglish
Pages (from-to)348-356
Number of pages9
JournalPhysica B: Condensed Matter
Volume304
Issue number1-4
DOIs
StatePublished - 1 Sep 2001

Keywords

  • Crystal structure
  • Diffusion
  • Fullerene
  • Phase transition
  • Thin films

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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