Temperature field in a multilayer assembly affected by a local laser heating

T. Elperin; G. Rudin

doi:10.1016/0017-9310(95)00067-J

Temperature field in a multilayer assembly affected by a local laser heating

T. Elperin, G. Rudin

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

An analytical solution of a three-dimensional heat conduction problem is obtained for a multilayer thin coating-substrate assembly affected by both stationary and moving laser beams. For both cases analytical expressions for the temperature distributions in an assembly are obtained under the assumption that the ratio of coating thickness to laser beam radius is small. The obtained expressions can be employed for analysis of thermal reliability of multilayer assemblies used in microelectronics.

Original language	English
Pages (from-to)	3143-3147
Number of pages	5
Journal	International Journal of Heat and Mass Transfer
Volume	38
Issue number	17
DOIs	https://doi.org/10.1016/0017-9310(95)00067-J
State	Published - 1 Jan 1995

ASJC Scopus subject areas

Condensed Matter Physics
Mechanical Engineering
Fluid Flow and Transfer Processes

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10.1016/0017-9310(95)00067-J

Cite this

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title = "Temperature field in a multilayer assembly affected by a local laser heating",

abstract = "An analytical solution of a three-dimensional heat conduction problem is obtained for a multilayer thin coating-substrate assembly affected by both stationary and moving laser beams. For both cases analytical expressions for the temperature distributions in an assembly are obtained under the assumption that the ratio of coating thickness to laser beam radius is small. The obtained expressions can be employed for analysis of thermal reliability of multilayer assemblies used in microelectronics.",

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AU - Rudin, G.

PY - 1995/1/1

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N2 - An analytical solution of a three-dimensional heat conduction problem is obtained for a multilayer thin coating-substrate assembly affected by both stationary and moving laser beams. For both cases analytical expressions for the temperature distributions in an assembly are obtained under the assumption that the ratio of coating thickness to laser beam radius is small. The obtained expressions can be employed for analysis of thermal reliability of multilayer assemblies used in microelectronics.

AB - An analytical solution of a three-dimensional heat conduction problem is obtained for a multilayer thin coating-substrate assembly affected by both stationary and moving laser beams. For both cases analytical expressions for the temperature distributions in an assembly are obtained under the assumption that the ratio of coating thickness to laser beam radius is small. The obtained expressions can be employed for analysis of thermal reliability of multilayer assemblies used in microelectronics.

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U2 - 10.1016/0017-9310(95)00067-J

DO - 10.1016/0017-9310(95)00067-J

M3 - Article

AN - SCOPUS:0029411340

SN - 0017-9310

VL - 38

SP - 3143

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JO - International Journal of Heat and Mass Transfer

JF - International Journal of Heat and Mass Transfer

IS - 17

ER -

Temperature field in a multilayer assembly affected by a local laser heating

Abstract

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