An analytical solution of a three-dimensional heat conduction problem is obtained for a multilayer thin coating-substrate assembly affected by both stationary and moving laser beams. For both cases analytical expressions for the temperature distributions in an assembly are obtained under the assumption that the ratio of coating thickness to laser beam radius is small. The obtained expressions can be employed for analysis of thermal reliability of multilayer assemblies used in microelectronics.
ASJC Scopus subject areas
- Condensed Matter Physics
- Mechanical Engineering
- Fluid Flow and Transfer Processes