TEMPO: Thermal-efficient management of power in high-throughput network switches

Tom Munk; Hillel Kugler; Ofir Maori; Adam Teman

doi:10.1109/VLSI-DAT.2019.8741684

TEMPO: Thermal-efficient management of power in high-throughput network switches

Tom Munk, Hillel Kugler, Ofir Maori, Adam Teman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.

Original language	English
Title of host publication	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Publisher	Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9781728106557
DOIs	https://doi.org/10.1109/VLSI-DAT.2019.8741684
State	Published - 1 Apr 2019
Externally published	Yes
Event	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 - Hsinchu, Taiwan, Province of China Duration: 22 Apr 2019 → 25 Apr 2019

Publication series

Name	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019

Conference

Conference	2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019
Country/Territory	Taiwan, Province of China
City	Hsinchu
Period	22/04/19 → 25/04/19

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Instrumentation
Computer Networks and Communications
Hardware and Architecture

Access to Document

10.1109/VLSI-DAT.2019.8741684

Cite this

Munk, T., Kugler, H., Maori, O., & Teman, A. (2019). TEMPO: Thermal-efficient management of power in high-throughput network switches. In 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019 Article 8741684 (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/VLSI-DAT.2019.8741684

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title = "TEMPO: Thermal-efficient management of power in high-throughput network switches",

abstract = "Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.",

author = "Tom Munk and Hillel Kugler and Ofir Maori and Adam Teman",

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doi = "10.1109/VLSI-DAT.2019.8741684",

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Munk, T, Kugler, H, Maori, O & Teman, A 2019, TEMPO: Thermal-efficient management of power in high-throughput network switches. in 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019., 8741684, 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019, Institute of Electrical and Electronics Engineers, 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019, Hsinchu, Taiwan, Province of China, 22/04/19. https://doi.org/10.1109/VLSI-DAT.2019.8741684

TEMPO: Thermal-efficient management of power in high-throughput network switches. / Munk, Tom; Kugler, Hillel; Maori, Ofir et al.
2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019. Institute of Electrical and Electronics Engineers, 2019. 8741684 (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - Communication rates of high-throughput network switches cause heat dissipation that can harm both performance and system reliability. Therefore, these systems integrate an aggressive cooling subsystem, often based on the operation of power-hungry fans at high-speeds to maintain a low ambient temperature. However, this may lead to both a high-degree of power waste and unacceptable acoustic levels. In this paper, we propose TEMPO, a thermal-efficient management scheme for system cooling with minimal fan power consumption and noise production, based on a straightforward, simple to apply algorithm. Tempo was applied to a Mellanox switch providing as much as a 30% power reduction and a 20% sound power reduction compared to the previously available commercial firmware.

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Munk T, Kugler H, Maori O, Teman A. TEMPO: Thermal-efficient management of power in high-throughput network switches. In 2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019. Institute of Electrical and Electronics Engineers. 2019. 8741684. (2019 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2019). doi: 10.1109/VLSI-DAT.2019.8741684

TEMPO: Thermal-efficient management of power in high-throughput network switches

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ASJC Scopus subject areas

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