The electro-adsorption chiller: A miniaturized cooling cycle with applications to micro-electronics

Jeffrey M. Gordon; K. C. Ng; H. T. Chua; A. Chakraborty

doi:10.1016/S0140-7007(02)00026-9

The electro-adsorption chiller: A miniaturized cooling cycle with applications to micro-electronics

Jeffrey M. Gordon, K. C. Ng, H. T. Chua, A. Chakraborty

Research output: Contribution to journal › Article › peer-review

54 Scopus citations

Abstract

A novel modular and miniature chiller is proposed that symbiotically combines adsorption and thermoelectric cooling devices. The seemingly low efficiency of each cycle individually is overcome by an amalgamation with the other. This electro-adsorption chiller incorporates solely existing technologies. It can attain large cooling densities at high efficiency, yet is free of moving parts and comprises harmless materials. The governing physical processes are primarily surface rather than bulk effects, or involve electron rather than fluid flow. This insensitivity to scale creates promising applications in cooling personal computers and other microelectronic appliances.

Original language	English
Pages (from-to)	1025-1033
Number of pages	9
Journal	International Journal of Refrigeration
Volume	25
Issue number	8
DOIs	https://doi.org/10.1016/S0140-7007(02)00026-9
State	Published - 1 Dec 2002

Keywords

Adsorption system
Application
Chiller
Electronics
Hybrid system
Miniaturization
Thermoelectricity

ASJC Scopus subject areas

Building and Construction
Mechanical Engineering

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10.1016/S0140-7007(02)00026-9

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title = "The electro-adsorption chiller: A miniaturized cooling cycle with applications to micro-electronics",

abstract = "A novel modular and miniature chiller is proposed that symbiotically combines adsorption and thermoelectric cooling devices. The seemingly low efficiency of each cycle individually is overcome by an amalgamation with the other. This electro-adsorption chiller incorporates solely existing technologies. It can attain large cooling densities at high efficiency, yet is free of moving parts and comprises harmless materials. The governing physical processes are primarily surface rather than bulk effects, or involve electron rather than fluid flow. This insensitivity to scale creates promising applications in cooling personal computers and other microelectronic appliances.",

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AU - Chakraborty, A.

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N2 - A novel modular and miniature chiller is proposed that symbiotically combines adsorption and thermoelectric cooling devices. The seemingly low efficiency of each cycle individually is overcome by an amalgamation with the other. This electro-adsorption chiller incorporates solely existing technologies. It can attain large cooling densities at high efficiency, yet is free of moving parts and comprises harmless materials. The governing physical processes are primarily surface rather than bulk effects, or involve electron rather than fluid flow. This insensitivity to scale creates promising applications in cooling personal computers and other microelectronic appliances.

AB - A novel modular and miniature chiller is proposed that symbiotically combines adsorption and thermoelectric cooling devices. The seemingly low efficiency of each cycle individually is overcome by an amalgamation with the other. This electro-adsorption chiller incorporates solely existing technologies. It can attain large cooling densities at high efficiency, yet is free of moving parts and comprises harmless materials. The governing physical processes are primarily surface rather than bulk effects, or involve electron rather than fluid flow. This insensitivity to scale creates promising applications in cooling personal computers and other microelectronic appliances.

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KW - Application

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KW - Electronics

KW - Hybrid system

KW - Miniaturization

KW - Thermoelectricity

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The electro-adsorption chiller: A miniaturized cooling cycle with applications to micro-electronics

Abstract

Keywords

ASJC Scopus subject areas

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