Thermal reliability of a bilayer slabsubjected to a local heat source

T. Elperin, G. Rudin

Research output: Contribution to journalArticlepeer-review

5 Scopus citations


The paper considers the distribution of temperature and thermal stresses in a bilayer slab which consists of a substrate and a thin coating subjected to a local short heat pulse. The heat source is distributed uniformly over a circular spot on a surface of the coating. The temperature and thermal stresses distributions in a slab are found analytically in a closed form using Laplace and Hankel integration transforms. The analytic relation is obtained for the evaluation of components of stress tensor in a coating as a function of a Fourier number and radius of heat source.

Original languageEnglish
Pages (from-to)37-43
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Issue number1
StatePublished - 1 Jan 1994

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering


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