Thermal stresses in a coating-substrate assembly caused by internal heat source

We determine two-dimensional temperature and thermal stresses distributions in a semiconductor coating-substrate assembly caused by the heat source at the contact surface. The analysis is based on the Laplace and Hankel integral transforms of equations of thermal elasticity, and the obtained analytical solutions can be used without any limitations on the duration of heating, the thickness of a coating, mechanical and thermal characteristics of materials. We consider the effect of the thickness of a coating, thermal mismatch between the substrate and the coating on the magnitude of thermal stresses. Using the obtained thermal stress distribution we analyze the delamination failure at the substrate-coating interface.