Thermo-mechanical failure criterion at the micron scale in electronic devices

Keyphrases

• Elastic Strain Energy 33%
• Electronic Devices 100%
• Fabrication Methods 33%
• Failure Criterion 100%
• Failure-free 33%
• Finite Element Model 33%
• Full-size 33%
• Interconnect Metal 33%
• Keyhole 33%
• Mechanical Design 33%
• Mechanical Properties 33%
• Metal Line 33%
• Microelectronics 66%
• Micron-scale 100%
• Passivated 33%
• Passivation Layer 66%
• Passivation Thickness 33%
• Plasma Power 33%
• Reentrant Corner 33%
• Strain Energy Density 66%
• Strain Energy Density Criterion 33%
• Thermomechanical Failure 100%
• Wafer 100%

Engineering

• Elastic Strain 33%
• Failure Criterion 100%
• Interconnects 33%
• Mechanical Design 33%
• Mechanical Failure 100%
• Microelectronics 66%
• Passivation 33%
• Passivation Layer 66%
• Strain Energy 33%
• Strain Energy Density 66%
• Strain Energy Density Criterion 33%