Titanium deposition onto copper substrates using the cold-plasma technique

A. Ruder, D. Itzhak

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


Titanium coatings were deposited onto copper substrates using the r.f. cold-plasma technique. The coatings were obtained from gas mixtures of TiCl4H2Ar. The substrate temperature was 550°C and the total gas pressure in the reactor was 2 mbar. The plasma was sustained by an r.f. generator of 27 MHz frequency at a power of about 650 W. Scanning electron microscopy, X-ray diffraction, transmission electron microscopy (TEM) and Auger electron spectroscopy were employed to identify and to characterize the coatings obtained. Coatings of thickness 10 μm were obtained after 5 h of deposition. The coatings were found to be slightly porous. Energy-dispersive analysis of X-rays was employed along the cross section of the coatings and the results indicate that titanium and copper compose the coating in varying concentrations. Chlorine impurities were found to constitute less than 0.5%. X-ray diffraction and TEM selected area diffraction revealed the presence of a mixture of various TiCu intermetallic compounds which compose the coating. Pure crystalline titanium was not observed.

Original languageEnglish
Pages (from-to)339-343
Number of pages5
JournalThin Solid Films
Issue number4
StatePublished - 26 Nov 1982

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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