Transient performance of a finned PCM heat sink

V. Shatikian, G. Ziskind, R. Letan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

The present study explores numerically the transient performance of a heat sink based on a phase change material (PCM), during the process of melting. Heat is transferred to the sink through its horizontal base, to which vertical fins made of aluminum are attached. The phase change material is stored between the fins. Its properties, including the melting temperature, latent and sensible specific heat, thermal conductivity and density in solid and liquid states, are based on a commercially available paraffin wax. A parametric investigation is performed for melting in a relatively small system, 10mm high, where the fin thickness is 1.2mm, and the distance between the fins varies from 2mm to 8mm. The temperature of the base varies from 12°C to 24°C above the mean melting temperature of the PCM. Transient numerical simulations are performed, yielding temperature evolution in the fins and the PCM. The computational results show how the transient phase-change process, expressed in terms of the volume melt fraction of the PCM, depends on the thermal and geometrical parameters of the system, which relate to the temperature difference between the base and the mean melting temperature, and to the thickness of the PCM layer

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages137-142
Number of pages6
StatePublished - 1 Dec 2005
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 17 Jul 200522 Jul 2005

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/07/0522/07/05

ASJC Scopus subject areas

  • General Engineering

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