Transition materials for silver-gold interconnects

Keyphrases

• Via Filling 100%
• Gold Interconnect 100%
• Silver Conductor 100%
• Aging 50%
• Thick Film 50%
• Humidity 50%
• Adhesion 50%
• Diffusion Rate 50%
• Thermal Cycling 50%
• Increased Demand 50%
• Good Yield 50%
• Interdiffusion 50%
• High Conductivity 50%
• Effective Barrier 50%
• Barrier Materials 50%
• Bonding Ability 50%
• Silver Diffusion 50%
• Multichip Modules 50%
• Thick Film Circuits 50%
• Internal Transition 50%
• Kirkendall Voids 50%
• Bond Wire 50%
• Wire Bonding 50%
• Transition State Barrier 50%
• LTCC Tapes 50%
• Microcircuit 50%
• Bond Pad 50%

Engineering

• Internals 100%
• Interconnects 100%
• Relative Humidity 25%
• Multilayer Film 25%
• Tape 25%
• Interdiffusion 25%
• Increasing Demand 25%
• Barrier Material 25%
• Thermal Cycle 25%
• Multichip Modules 25%
• Thick Film Circuits 25%
• Bonding Wire 25%

Material Science

• Silver 100%
• Conductor 100%
• Electronic Circuit 42%
• Thick Films 28%
• Low Temperature Co-Fired Ceramics 28%
• Tape 14%