The importance of the development of high-end computers (HEC) lies in their ability to solve complex problems in many areas of science and engineering. In order to develop the next generation of HEC faster buses are required. However, faster buses cannot be achieved in a cost-effective way by means of further scaling of today's electrical technology. Some of the parameters that prevent this further scaling include power dissipation, chip pin-out, RF interference and clock propagation delay in addition to huge energy consumption. In order to overcome the scaling limitations related to electrical buses without using cumbersome and bulky fiber/w optical links, the concept of the unguided optical communication bus (UOCB) has been introduced. UOCB is a technology for transmitting information through material from one point to many points without a waveguide, while taking advantage of scattering and diffusion effects. In this work we analyze the mechanical and optical characteristics of polycarbonate in order to evaluate its potential as a candidate material for UOCB motherboard fabrication. We compare mechanical characteristics, such as Young's module and Poisson's ratio, of conventional motherboard materials (FR4) to polycarbonate and conclude that polycarbonate could satisfy the mechanical requirements. Monte-Carlo simulations were performed on the basis of the optical characteristics of the polycarbonate doped by nanoparticles and the physical dimensions of the motherboard. The results of the work indicate that the proposed concept could support next generation bus architecture.