TY - GEN
T1 - Unguided optical bus for next-generation computers
T2 - 2010 IEEE 26th Convention of Electrical and Electronics Engineers in Israel, IEEEI 2010
AU - Freilikhman, Alex
AU - Arnon, Shlomi
PY - 2010/12/1
Y1 - 2010/12/1
N2 - The importance of the development of high-end computers (HEC) lies in their ability to solve complex problems in many areas of science and engineering. In order to develop the next generation of HEC faster buses are required. However, faster buses cannot be achieved in a cost-effective way by means of further scaling of today's electrical technology. Some of the parameters that prevent this further scaling include power dissipation, chip pin-out, RF interference and clock propagation delay in addition to huge energy consumption. In order to overcome the scaling limitations related to electrical buses without using cumbersome and bulky fiber/w optical links, the concept of the unguided optical communication bus (UOCB) has been introduced. UOCB is a technology for transmitting information through material from one point to many points without a waveguide, while taking advantage of scattering and diffusion effects. In this work we analyze the mechanical and optical characteristics of polycarbonate in order to evaluate its potential as a candidate material for UOCB motherboard fabrication. We compare mechanical characteristics, such as Young's module and Poisson's ratio, of conventional motherboard materials (FR4) to polycarbonate and conclude that polycarbonate could satisfy the mechanical requirements. Monte-Carlo simulations were performed on the basis of the optical characteristics of the polycarbonate doped by nanoparticles and the physical dimensions of the motherboard. The results of the work indicate that the proposed concept could support next generation bus architecture.
AB - The importance of the development of high-end computers (HEC) lies in their ability to solve complex problems in many areas of science and engineering. In order to develop the next generation of HEC faster buses are required. However, faster buses cannot be achieved in a cost-effective way by means of further scaling of today's electrical technology. Some of the parameters that prevent this further scaling include power dissipation, chip pin-out, RF interference and clock propagation delay in addition to huge energy consumption. In order to overcome the scaling limitations related to electrical buses without using cumbersome and bulky fiber/w optical links, the concept of the unguided optical communication bus (UOCB) has been introduced. UOCB is a technology for transmitting information through material from one point to many points without a waveguide, while taking advantage of scattering and diffusion effects. In this work we analyze the mechanical and optical characteristics of polycarbonate in order to evaluate its potential as a candidate material for UOCB motherboard fabrication. We compare mechanical characteristics, such as Young's module and Poisson's ratio, of conventional motherboard materials (FR4) to polycarbonate and conclude that polycarbonate could satisfy the mechanical requirements. Monte-Carlo simulations were performed on the basis of the optical characteristics of the polycarbonate doped by nanoparticles and the physical dimensions of the motherboard. The results of the work indicate that the proposed concept could support next generation bus architecture.
KW - Mie scattering
KW - Monte Carlo
KW - Optical mother board
KW - Wireless optical communication
UR - http://www.scopus.com/inward/record.url?scp=78651243165&partnerID=8YFLogxK
U2 - 10.1109/EEEI.2010.5661950
DO - 10.1109/EEEI.2010.5661950
M3 - Conference contribution
AN - SCOPUS:78651243165
SN - 9781424486809
T3 - 2010 IEEE 26th Convention of Electrical and Electronics Engineers in Israel, IEEEI 2010
SP - 906
EP - 910
BT - 2010 IEEE 26th Convention of Electrical and Electronics Engineers in Israel, IEEEI 2010
Y2 - 17 November 2010 through 20 November 2010
ER -