Wetting and interface phenomena in the B4C/(Cu-B-Si) system

M. Aizenshtein, N. Froumin, E. Shapiro-Tsoref, M. P. Dariel, N. Frage

Research output: Contribution to journalArticlepeer-review

30 Scopus citations


The addition of Si to a Cu-B liquid alloy improves wetting of the boron carbide substrate and allows maintaining a flat metal/ceramic interface. Improved wetting is associated with a shift of the boron content in the near surface layer of the substrate towards a higher B/C ratio. The experimental results are consistent with the thermodynamic analysis of the Cu-B-C-Si system.

Original languageEnglish
Pages (from-to)1231-1235
Number of pages5
JournalScripta Materialia
Issue number11
StatePublished - 1 Dec 2005


  • Boron carbide
  • Cu-alloys
  • Interface
  • Joining
  • Wetting

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


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