Abstract
The addition of Si to a Cu-B liquid alloy improves wetting of the boron carbide substrate and allows maintaining a flat metal/ceramic interface. Improved wetting is associated with a shift of the boron content in the near surface layer of the substrate towards a higher B/C ratio. The experimental results are consistent with the thermodynamic analysis of the Cu-B-C-Si system.
Original language | English |
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Pages (from-to) | 1231-1235 |
Number of pages | 5 |
Journal | Scripta Materialia |
Volume | 53 |
Issue number | 11 |
DOIs | |
State | Published - 1 Dec 2005 |
Keywords
- Boron carbide
- Cu-alloys
- Interface
- Joining
- Wetting
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys