Wetting of TiC by non-reactive liquid metals

N. Frage, N. Froumin, M. P. Dariel

Research output: Contribution to journalArticlepeer-review

122 Scopus citations

Abstract

This paper is concerned with the wetting of TiC substrates by the non-reactive metals (Me = Cu, Ag, Au and Sn). The contact angle in the TiC/Sn and TiC/Cu systems reaches an equilibrium value slightly below 90° owing to the partial dissolution of titanium carbide in the molten metals. The intrinsic non-wetting behavior in the TiC/Ag system was confirmed. In the TiC/Au system, the non-wetting behavior is attributed to the strong metal-ceramic interaction that takes place at the interface and leads to the formation of a graphite layer. The addition of Fe or Ni increases the solubility of carbon in molten Au and decreases considerably the contact angle by preventing the formation of a graphite layer at the interface. Alloying non-reactive metals with Ti was done either by direct addition to the melt or by transfer from a sub-stoichiometric titanium carbide substrate. In both instances, the presence of Ti in the liquid metal, irrespective of its origin, improves wetting dramatically. The specific wetting behavior of the different Me-Ti alloys are well accounted for by the basic thermodynamic properties of the respective Me-Ti systems and of the titanium carbide phase.

Original languageEnglish
Pages (from-to)237-245
Number of pages9
JournalActa Materialia
Volume50
Issue number2
DOIs
StatePublished - 22 Jan 2002

Keywords

  • Carbides
  • Liquid metals
  • Surfaces & interfaces
  • Thermodynamics
  • Wetting

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

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