Abstract
This paper is concerned with the wetting of TiC substrates by the non-reactive metals (Me = Cu, Ag, Au and Sn). The contact angle in the TiC/Sn and TiC/Cu systems reaches an equilibrium value slightly below 90° owing to the partial dissolution of titanium carbide in the molten metals. The intrinsic non-wetting behavior in the TiC/Ag system was confirmed. In the TiC/Au system, the non-wetting behavior is attributed to the strong metal-ceramic interaction that takes place at the interface and leads to the formation of a graphite layer. The addition of Fe or Ni increases the solubility of carbon in molten Au and decreases considerably the contact angle by preventing the formation of a graphite layer at the interface. Alloying non-reactive metals with Ti was done either by direct addition to the melt or by transfer from a sub-stoichiometric titanium carbide substrate. In both instances, the presence of Ti in the liquid metal, irrespective of its origin, improves wetting dramatically. The specific wetting behavior of the different Me-Ti alloys are well accounted for by the basic thermodynamic properties of the respective Me-Ti systems and of the titanium carbide phase.
Original language | English |
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Pages (from-to) | 237-245 |
Number of pages | 9 |
Journal | Acta Materialia |
Volume | 50 |
Issue number | 2 |
DOIs | |
State | Published - 22 Jan 2002 |
Keywords
- Carbides
- Liquid metals
- Surfaces & interfaces
- Thermodynamics
- Wetting
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Polymers and Plastics
- Metals and Alloys